High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting
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...Thermal Epoxy Glue for Electronic Components Potting Product Summary: TIE™280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life,fire resistant epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet.pdf Feature > Good thermal conductive: 1.2W/mK......
Dongguan Ziitek Electronical Material and Technology Ltd.
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black Two Component Epoxy Thermal Conductive Glue 1.2W/mK for LED Lighting,water proof,adhesive paste -40℃ to +130℃
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... epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity, expediting air releaseed. > Excellent in...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue
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...Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue Product Summary: TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure. Feature > Good thermal conductivity: 2.5W/mK......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Thermal Conductivity 0.8-0.9W/mK Viscosity 200-500 Impact Strength 8-16kJ/m2 Electrial Insulating Epoxy Resin
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Product Description: A thermosetting insulation resin, this electrical epoxy compound is a dielectric epoxy glue that is ideal for use in a wide variety of industrial and commercial applications. The epoxy/hardener mixture temperature required for this ......
Shanghai Wenyou Industry Co., Ltd.
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