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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Categories Thermal Epoxy Glue
Brand Name: Ziitek
Model Number: TIE™380-25
Certification: RoHS
Place of Origin: China
MOQ: 10kg
Price: 1-100USD/kg
Payment Terms: T/T
Supply Ability: 10000kg/month
Delivery Time: 3-8 work days
Packaging Details: 1kg/can
Products name: High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound
Material: Epoxy glue
Usage: bonding electronics
Appearance sured: Dull Gray Solid
Continuous use temp: -40 to 180℃
Thermal conductivity: 2.5 W/mK
Keywords: Thermal Epoxy Glue
  • Product Details
  • Company Profile

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound


Product Summary:


TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.


Spec-of-TIE380-25.pdf


Feature


> Outstanding thermal performance 2.5W/mK
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction


Applications


> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers


Typical Properties of TIETM380-25

Chemical typeEpoxyTest Method
Appearance uncuredGray PasteVisual
Appearance curedDull Gray SolidVisual
ComponentsOne Component*****
Heat Capacity0.7 l/g-KASTM C351
Key SubstratesMetals, ceramics*****
Hardness92 Shore AASTM 2240
Continuous Use Temp-40 to 180℃*****
Tensile strength Al/Al @25°C>2800psi*****
Thermal Conductivity2.5 W/m-KASTM D5470
Packing details

1kg/can

*****

Application Features:TIE™380-25


Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)


Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes


Company profile


Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Quality High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound for sale
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