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Cu - ETP Grade Pure Copper Foil For FCCL , Treated Surface Copper Foiling

Categories RA Copper Foil
Brand Name: Civen
Model Number: MGP-TRA021010
Certification: ISO 9001 CERTIFICATE
Place of Origin: China
MOQ: 1000 KG ( 2205 LB )
Price: USD 5.0 To 50 Per KG
Payment Terms: L/C, T/T
Supply Ability: 550 MT Per Month
Delivery Time: 10 - 15 Days
Packaging Details: Strengthen Cardboard Inner Core And Exporting Wooden Case
Material: Red Copper
Ordinary Thickness: 12 um / 18 um / 35 um
Ordinary Width: Up To 600 mm ( 23.6 inch )
Matte Side: Gray Color
Shape: Coil
H . S . Code: 7410.11
  • Product Details
  • Company Profile

Cu - ETP Grade Pure Copper Foil For FCCL , Treated Surface Copper Foiling

Cu - ETP Grade Pure Copper Foil For FCCL Application Treated Surface

Company Profile:

CIVEN delivers a wide range of copper and its alloy products to demanding customers in the

electrotechnical industry. In the last ten years we have developed into one of the leading Chinese

suppliers of copper material. During this period we were able to make use of decades of experience from

contacts with our customers, responding specifically to individual wishes and guaranteeing top-quality

products.


Applications:

FCCL, FPC Usement.

Dimension Range:

  1. Copper Foil thickness from 12~100µm can be supplied for FPC.
  2. Width can be made according to clients’ requirement up to 600mm.


Performances:

  1. High flexibility and extensibility
  2. Even and smooth surface
  3. Good fatigue resistance
  4. Strong antioxidant properties
  5. Good mechanical properties


Features:

The material has higher extensibility, and has a high bending resistance and no crack.

Raw Material :


Name

GB

ALLOY NO.

SIZE (mm)

(ISO)

(ASMT)

(JIS)

(BIS)

(DIN)

Copper Foil

T2

Cu-ETP

C11000

C1100

C101

R-Cu57

Thickness: 0.006-0.1 /Max Width: 650


FPC T2 high flex rolled copper foil properties (IPC-6542)

Item

Unit

Parameters

12μm

18μm

25μm

35μm

70μm

Mass per unit(±5%)

g/m²

105

160

300

400

445

Cu+Ag

%

≥99.99

Temper


H

O,H

O,H

O,H

O,H

Surface roughness

Ra

μm

0.13

0.12

0.1

0.08

0.08

Rz

μm

1.3

1.0

0.8

0.74

0.76


High Temp /220℃

N/mm²

≥140

≥150

≥170

≥210

≥220

Elongation

Normal Temp /23℃

%

≥1.5

≥3.0

≥4.0

≥4.2

≥4.5

High Temp /220℃

%

≥8

≥10

≥18

≥28

≥30

Fatigue Resistance (annealed)

%

65

65

65

65

65

Maximum resistivity

Ωmm2/m

0.0181

Electrical conductivity

%

≥98.3%

Film and adhesive layers

Instant Temp.

300℃/10s

Film and adhesive paste after transient
temperature without blistering delamination.

Anti oxidation

H.T.(200℃)

Minute

Won’t Change the Color within 60 minutes

Pinhole test results

piece/ m²

Pinhole area more than 0.5 mm²,0.005 piece/ m²

Tensile strength

Normal Temp /23℃

N/mm²

≥430

≥450

≥450

≥450

≥450


Note:
1 . Above figures based on the material with 0.05mm in thickness and 600mm in width .
2 . Normally , Copper , cobalt and nickel is coated on the rough surface
3 . Testing method follows our company standard .


18μm-SEM

35μm-SEM




Supplement :


If technical data is required, please contact our customer service representative to enter a technical service request for the specific data needed.


Why Choose Civen As Your Supplier :


1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!


Our Contact :


Quality Cu - ETP Grade Pure Copper Foil For FCCL , Treated Surface Copper Foiling for sale
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